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Product Description
The HJ30J Series Micro Rectangular High-Speed Connectors are designed for high-density, high-speed board-to-board interconnections in chassis and cabinet-level applications, offering excellent electrical performance and mechanical reliability in harsh environments.
Key Features
- Flexible stranded pin contacts for enhanced reliability
- High-density contact layout with 1.27 mm × 1.27 mm pitch
- Metal shielding shell for superior EMI protection
- Available in 7 shell sizes: 12, 18, 24, 30, 36, 55, 100 contacts
- Ideal for high-speed signal transmission between boards
Technical Specifications
| Parameter | Specification |
| Operating temperature | –55°C to +125°C |
| Characteristic impedance | 100 ±15 Ω |
| Rated current | 3 A |
| Contact resistance | ≤ 20 mΩ |
| Dielectric withstand voltage | 800 V (room temperature) |
| Insulation resistance | ≥ 5000 MΩ (500 VDC); ≥ 100 MΩ (wet heat) |
| Data transmission rate | Up to 1.65 Gbps |
| Mechanical life | 500 mating cycles |
| Vibration | 10–2000 Hz, 196 m/s² |
| Shock | 735 m/s² |
